Description

<style>.e_editor{font:14px/24px Roboto,Helvetica,Tahoma,Arial,'Microsoft YaHei','b8bf53';}.e_editor div,e_editor p,e_editor td,e_editor th,e_editor li{font-weight:inherit;font-size:inherit;font-style:inherit;font-family:inherit;}.e_editor ul{margin:-10px 0 20px;}.e_editor li{padding:5px 0;}.e_table{width:96%;border-collapse:collapse;empty-cells:show;}.e_table th,.e_table td{padding:5px;border:2px solid #eee;}.e_img{padding:10px 0;text-align:center;}.e_p{line-height:20px;padding:0 0 20px;text-indent:0em;}</style> <div class="e_editor"> <div class="e_p" style="text-align:center;"> <strong><img src="https://file.allpcb.com/bbs/17/05/19/170619853.jpg" alt="" /></strong> </div> <div class="e_p"> <strong>First, plug hole process after hot air leveling.</strong> </div> <div class="e_p"> This process is: plate resistance welding → HAL → plug hole → curing </div> <div class="e_p"> Disadvantages: </div> <div class="e_p"> Easy to cause plug hole ink pollute board. So many customers do not accept this method. </div> <div class="e_p"> <strong>Second, the plug hole process before hot air leveling.</strong>There are 4 method: </div> <div class="e_p"> 2.1 Process: pre-treatment → plug hole → grinding plate → graphics transfer → etching → plate resistance welding </div> <div class="e_p"> 2.2 pre-treatment - plug hole - silk screen - pre-baking - exposure a development - curing </div> <div class="e_p"> Advantages: open hole cover oil is good with wet film color. </div> <div class="e_p"> Hot air leveling is to ensure that the vias are not on the tin and the hole is not hidden tin beads. </div> <div class="e_p"> Disadvantages: easy to result in poor solderability. </div> <div class="e_p"> 2.3 pre-treatment - plug a pre-bake - development - pre-curing - plate resistance welding </div> <div class="e_p"> But after HAL, it is difficult to completely solve tin beads in vias,so many customers do not receive. </div> <div class="e_p"> 2.4 plate welding and plug hole are at the same time to be completed. </div> <div class="e_p"> The process is: pre-treatment - silk screen - pre-bake - exposure - development - curing </div> <div class="e_p"> Advantage: </div> <div class="e_p"> This process is short and the utilization of the equipment is high </div> <div class="e_p"> Disadvantages: </div> <div class="e_p"> In the curing, the air expansion will break through the solder mask, resulting in empty and uneven </div> </div>