Description

<style>.e_editor{font:14px/24px Roboto,Helvetica,Tahoma,Arial,'Microsoft YaHei','b8bf53';}.e_editor div,e_editor p,e_editor td,e_editor th,e_editor li{font-weight:inherit;font-size:inherit;font-style:inherit;font-family:inherit;}.e_editor ul{margin:-10px 0 20px;}.e_editor li{padding:5px 0;}.e_table{width:96%;border-collapse:collapse;empty-cells:show;}.e_table th,.e_table td{padding:5px;border:2px solid #eee;}.e_img{padding:10px 0;text-align:center;}.e_p{line-height:20px;padding:0 0 20px;text-indent:0em;}</style> <div class="e_editor"> <div class="e_p"> A question for you all! </div> <div class="e_p"> Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. </div> <div class="e_p"> My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clean under 20 mil pitch QFP's because the water molecules (that was the reason often given) couldn't evacuate particulate material left under components. What's changed - especially concerning CSP's as uBGA's etc. with clearances under 10 mils under them. </div> </div>