WE ARE EXPERENCING OPEN 8 MILL VIAS UNDER THE BGA'S, THEY ARE OPENING AFTER THE ASSEMBLY PROCESS, THEY ARE FROM MULTIPLE PCB VENDORS, THEY PASS AT THE PCB SUPPLIERS TESTING, AND WE HAVE FOUND THAT THEY HAVE HAD 2 MAJOR CAUSES 1. BUBBLE INTRAPMENT, 2. DEBRIS IN THE BARREL. WE EXPECT TO SEE SOME FALL OUT FROM THE PCB SUPPLIER BUT THIS PROBLEM IS HIGHER THAN THE 1% WE WOULD EXPECT TO SEE. IS ANY ONE ELSE SEEING THIS KIND OF PROBLEM?
Oguz AGCELI
2/4/2017 9:10:01 AM
Excellent!
kotec.shop
2/4/2017 9:10:01 AM
Pretty good and useful info for beginners.
Greg Walton
2/4/2017 9:10:01 AM
Bookmarked.Really helpful.
Nick Jay
2/4/2017 9:10:01 AM
It is pretty helpful to my daily learning.