ENIG-BLACK PAD
Published on 2/27/2017 10:40:55 PM
Description
<style>.e_editor{font:14px/24px Roboto,Helvetica,Tahoma,Arial,'Microsoft YaHei','b8bf53';}.e_editor div,e_editor p,e_editor td,e_editor th,e_editor li{font-weight:inherit;font-size:inherit;font-style:inherit;font-family:inherit;}.e_editor ul{margin:-10px 0 20px;}.e_editor li{padding:5px 0;}.e_table{width:96%;border-collapse:collapse;empty-cells:show;}.e_table th,.e_table td{padding:5px;border:2px solid #eee;}.e_img{padding:10px 0;text-align:center;}.e_p{line-height:20px;padding:0 0 20px;text-indent:0em;}</style> <div class="e_editor"> <div class="e_p"> It is very common to relate ENIG pad surface finishing with BLACK PAD defect. However, is anyone know why BLACK PAD defect only happen on fine pitch pad areas such as BGA, QFP? Why this defect did not or seldom happen on capacitor or resistor pad? </div> </div>
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